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High purity Glob Top material for COB (Chip On Board) and TAB (Tape Automated Bonding) applications, high purity underfill material for flip chips, high purity chip coating material for tape carrier packages, etc.

Full range of black epoxy molding compounds for encapsulation of various semiconductor IC packages. White epoxy molding compound for encapsulation of photocouplers and optocouplers.

 

Normal colors, metallic colors, pearl colors, chameleon colors and bright light colors; laser-cuttable and uncuttable inks; for silicone and plastic.

Full range of colors for IMD inks. Different film types for flat, shallow and deep draw applications including TPU, PC, PET, PC-PBT, PC-PET, etc. Special non-yellowish TPU available.